Using PCB copper area to dissipate the heat produced by surface mount components.

Removing heat from surface mount components during the initial phase of product development can significantly add to the design work and rework. In this paper we briefly describe the thermal behavior of surface mount components on a single sided PCB. We produced graphs to help the designer choose the PCB specifications that would satisfy the thermal requirement. The graphs also show the limitations of using the copper area on the PCB as a Heatsink.Read complete PDF

Rabinson Shakya, Nesh Basnet, Shiraz Macuff